AI BriefingTech Week Singapore 2026: Liquid Cooling and Modular Design Are Key for AI Data Centers
·2026.10.21 14:47
Key point
Securing power and land for AI data centers and cultivating specialized talent have emerged as key challenges.
Details
- At Tech Week Singapore 2026, liquid cooling, modular design, power infrastructure, and operational automation technologies for AI data centers were discussed as major topics
- Liquid cooling technologies, such as LG's Chip-to-Chiller and immersion cooling, are expanding to overcome the limitations of traditional air cooling in high-density GPU environments
- The modular data center approach, which uses standardized units pre-assembled to shorten on-site installation time, is gaining attention for its construction speed and scalability
- Securing power and land for data center construction, raising investment funds, and cultivating specialized talent for the AI automation era have emerged as industry challenges as important as technology
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