Intel's Xe3P GPU with 160GB LPDDR5X leaked

PCB information for Intel's next-generation data center GPU, Xe3P, has leaked. The core of this design is the adoption of 160GB of LPDDR5X memory to bypass the HBM (High Bandwidth Memory) supply shortage issue.

Based on the leaked information, the key expected specifications are as follows:

• Memory Configuration: A total of 160GB of large-capacity memory secured using 20 8GB LPDDR5X modules.
• Memory Bandwidth: Assuming a 32-bit interface, it would have a 640-bit width, and is estimated to provide approximately 704-760GB/s of bandwidth based on 8800-9500MT speeds.
• Other Specifications: Uses a 16-pin connector.

This design appears to focus on reducing dependence on HBM while still securing the high memory capacity essential for large language model (LLM) inference.