AI BriefingTSMC Adds $100 Billion to US Investment
Key point
TSMC has expanded its investment scale to $265 billion to strengthen its AI semiconductor production capabilities in the United States.
Details
TSMC has increased its investment scale in the United States by an additional $100 billion from the previous level, bringing the total to $265 billion. This investment will be used to construct at least four sub-2nm process fabs in Arizona and expand advanced packaging (CoWoS) capacity.
The construction cost for a single 2nm-class fab module is estimated at $25 billion to $35 billion, and this investment is sufficient to build approximately four modules. Chip production for Apple and Nvidia has already begun at the first fab in Arizona, while construction of the second fab is complete, with equipment installation scheduled to begin in Q3 2026.
By transferring CoWoS capacity, which was a bottleneck in AI accelerator production, to the United States, US customers are expected to be able to handle everything from chip manufacturing to packaging domestically. CEO C.C. Wei did not provide a specific timeline, stating that production speed will be determined by demand.
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